BMEXBP1002H | Schneider Electric Ruggedized Dual-Ethernet & X-Bus Backplane For Modicon X80 Systems
- Regular price
- $579.00
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- $579.00
- Regular price
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Product Description P/N: BMEXBP1002H
Description
The Schneider Electric BMEXBP1002H is a ruggedized backplane designed for Modicon X80 automation architectures operating in severe industrial environments. This unit provides stable connectivity through dual Ethernet and X-bus interfaces, supporting reliable module communication and robust system performance.
Technical Specifications
| Condition | New/Never Used Surplus |
| Brand | Schneider Electric |
| Category | Computer |
| Part Number | BMEXBP1002H |
| Subcategory | CPU Rack |
| Main Function | Backplane / Rack |
| Product Series / Family Name | Modicon X80 |
| Sub-Range Name | Modicon X80 Backplanes / Racks |
| Functions | Ruggedized Dual Ethernet and X-Bus Backplane |
| Design | For Severe Environments (Conformal Coating) |
| Connection Capacity | 10 × Ethernet + X-Bus Connectors |
| Slot Capacity | 10 Slots |
| Mounting Mode | DIN Rail (35 mm) or Panel Mounting |
| Degree of Protection | IP20 |
| Operating Temperature | −13…+158 °F / −25…+70 °C |
| Storage Temperature | −40…+185 °F / −40…+85 °C |
| Humidity Tolerance | 5–95% (Non-Condensing) |
| Application Area | Modular PLC Backplane for Harsh Environments |
| Coating Type | Industrial Conformal Protective Coating |
Information About BMEXBP1002H
The BMEXBP1002H is a ruggedized backplane developed for Schneider Electric’s Modicon X80 series, designed to support Ethernet and X-bus communication across modular automation systems. Built with conformal coating, the unit is engineered to withstand harsh industrial conditions, including dust, humidity, and temperature extremes. The structure accommodates ten module slots while providing extensive connectivity through dual Ethernet ports and integrated X-bus interfaces. Its compatibility with DIN rail and panel mounting systems allows flexible installation across various industrial control panels and machinery frameworks.
Key Features:
- Ruggedized Construction for Harsh Environments: Built with industrial-grade conformal coating that shields circuitry from moisture, dust, and corrosive airborne contaminants, improving long-term system durability.
- Dual Ethernet and X-Bus Integration: Provides stable communication paths for distributed PLC modules, allowing high-speed networking and synchronized data exchange across Modicon X80 components.
- Ten-Slot Modular Expansion: Supports up to ten modules on a single backplane, enabling scalable system architecture for complex control applications.
- Flexible Mounting Options: Compatible with standard 35 mm DIN rail installations or panel mounting, allowing adaptation to a wide range of control cabinet designs.
- Wide Industrial Temperature Range: Operates from −13°F to +158°F (−25°C to +70°C), ensuring reliable performance in environments with extreme heat or cold.
- High Humidity Resistance: Designed to withstand 5–95% non-condensing humidity, supporting deployment in moisture-prone or semi-outdoor industrial areas.
- IP20 Protection Level: Prevents accidental contact with internal components while maintaining compact form factor suitable for enclosed panel installations.
- Optimized for Modicon X80 Systems: Ensures full compatibility with Schneider Electric automation frameworks, providing consistent mechanical, electrical, and communication alignment.
The BMEXBP1002H delivers the reliability and precision required for modular PLC infrastructures operating in harsh industrial and environmental conditions.
Description
The Schneider Electric BMEXBP1002H is a ruggedized backplane designed for Modicon X80 automation architectures operating in severe industrial environments. This unit provides stable connectivity through dual Ethernet and X-bus interfaces, supporting reliable module communication and robust system performance.
Technical Specifications
| Condition | New/Never Used Surplus |
| Brand | Schneider Electric |
| Category | Computer |
| Part Number | BMEXBP1002H |
| Subcategory | CPU Rack |
| Main Function | Backplane / Rack |
| Product Series / Family Name | Modicon X80 |
| Sub-Range Name | Modicon X80 Backplanes / Racks |
| Functions | Ruggedized Dual Ethernet and X-Bus Backplane |
| Design | For Severe Environments (Conformal Coating) |
| Connection Capacity | 10 × Ethernet + X-Bus Connectors |
| Slot Capacity | 10 Slots |
| Mounting Mode | DIN Rail (35 mm) or Panel Mounting |
| Degree of Protection | IP20 |
| Operating Temperature | −13…+158 °F / −25…+70 °C |
| Storage Temperature | −40…+185 °F / −40…+85 °C |
| Humidity Tolerance | 5–95% (Non-Condensing) |
| Application Area | Modular PLC Backplane for Harsh Environments |
| Coating Type | Industrial Conformal Protective Coating |
Information About BMEXBP1002H
The BMEXBP1002H is a ruggedized backplane developed for Schneider Electric’s Modicon X80 series, designed to support Ethernet and X-bus communication across modular automation systems. Built with conformal coating, the unit is engineered to withstand harsh industrial conditions, including dust, humidity, and temperature extremes. The structure accommodates ten module slots while providing extensive connectivity through dual Ethernet ports and integrated X-bus interfaces. Its compatibility with DIN rail and panel mounting systems allows flexible installation across various industrial control panels and machinery frameworks.
Key Features:
- Ruggedized Construction for Harsh Environments: Built with industrial-grade conformal coating that shields circuitry from moisture, dust, and corrosive airborne contaminants, improving long-term system durability.
- Dual Ethernet and X-Bus Integration: Provides stable communication paths for distributed PLC modules, allowing high-speed networking and synchronized data exchange across Modicon X80 components.
- Ten-Slot Modular Expansion: Supports up to ten modules on a single backplane, enabling scalable system architecture for complex control applications.
- Flexible Mounting Options: Compatible with standard 35 mm DIN rail installations or panel mounting, allowing adaptation to a wide range of control cabinet designs.
- Wide Industrial Temperature Range: Operates from −13°F to +158°F (−25°C to +70°C), ensuring reliable performance in environments with extreme heat or cold.
- High Humidity Resistance: Designed to withstand 5–95% non-condensing humidity, supporting deployment in moisture-prone or semi-outdoor industrial areas.
- IP20 Protection Level: Prevents accidental contact with internal components while maintaining compact form factor suitable for enclosed panel installations.
- Optimized for Modicon X80 Systems: Ensures full compatibility with Schneider Electric automation frameworks, providing consistent mechanical, electrical, and communication alignment.
The BMEXBP1002H delivers the reliability and precision required for modular PLC infrastructures operating in harsh industrial and environmental conditions.