IS200VAOCH1C | General Electric Analog Output Board

Description

The IS200VAOCH1C is a PCB component developed by GE for integration into their Mark VI system, a member of the "Speedtronic" steam/gas heavy-duty turbine management systems. Positioned within the VME rack, this board receives digital values via the VME backplane from the VCMI board, which are then converted into analog output currents. These currents are directed to the VAOC's terminal board for measurement and subsequent feedback to the VAOC for control. 

An essential feature of the IS200VAOCH1C is its designation as a second-generation VAOC board, enabling support for higher load resistance on the first eight output circuits, accommodating up to 800 Ω compared to the 500 Ω of the remaining eight output circuits. 

The board hosts multiple connectors, including two backplanes, and incorporates sixteen relays positioned near the front right corner, each accompanied by a relay diagram. Integrated circuits such as oscillating chips, FPGAs, and SRAM chips are present on the board surface, alongside resistors, diodes, and capacitors of various resistance/capacitance and materials. 

Technical Specifications

Information About IS200VAOCH1C

The IS200VAOCH1C is a PCB component developed by GE for incorporation into their Mark VI system, a later iteration of the "Speedtronic" steam/gas heavy-duty turbine management systems manufactured by GE over multiple decades. 

Mounted within the VME rack, the IS200VAOCH1C receives digital values via the VME backplane from the controller, facilitated by the VCMI board. These digital values undergo conversion to analog output currents, subsequently transmitted to the VAOC's terminal board for measurement and feedback to the VAOC for control. Notably, the IS200VAOCH1C is a second-generation VAOC board designed to support higher load resistance on the first eight output circuits, enabling operation with an 800 Ω load resistance compared to the 500 Ω of the remaining eight output circuits. 

Featuring multiple connectors, including two backplanes, the board incorporates sixteen relays positioned near the front right corner, each accompanied by a relay diagram. Various integrated circuits, such as oscillating chips, FPGAs (field programmable gate arrays), and SRAM chips, populate the board surface, alongside resistors, diodes, and capacitors of differing resistance/capacitance and materials. 

 

Manufacturer information

General Electric (GE) is a multinational conglomerate founded in 1892, based in the United States. It operates in various industries, including aviation, healthcare, renewable energy, and power. GE is known for its innovations in technology, manufacturing, and infrastructure solutions.

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