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XCVU37P-2FSVH2892E | Xilinx Virtex UltraScale+ FPGA, 2851800 Logic Cells, 2892-Ball BGA
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Product Description P/N: XCVU37P-2FSVH2892E
Description
The XCVU37P-2FSVH2892E is a high-performance FPGA from the Xilinx Virtex UltraScale+ family, designed for compute-intensive and memory-focused applications. Featuring over 2.8 million logic cells and support for advanced memory interfaces, it is suitable for next-generation networking, signal processing, and data center acceleration.
Technical Specifications
| Condition | New/Never Used Surplus |
|---|---|
| Brand | Xilinx |
| Category |
Programmable Logic
|
| Part Number | XCVU37P-2FSVH2892E |
| Subcategory | Field Programmable Gate Arrays (FPGAs) |
| Product Type | Field Programmable Gate Array (FPGA) |
| Series | Virtex UltraScale+ |
| Logic Cells | 2,851,800 |
| CLBs | 162,960 |
| I/Os | 624 inputs, 624 outputs |
| Package Type | BGA2892 (S-PBGA-B2892, 55×55 mm) |
| Terminal Pitch | 1.0 mm |
| Seated Height Max | 4.51 mm |
| Voltage Range (Core) | 0.825 V – 0.876 V (0.85 V nominal) |
| Operating Temperature | Up to +100 °C |
| Moisture Sensitivity Level (MSL) | 4 |
| Terminal Finish | Tin-Silver-Copper (e1) |
| Reflow Temperature Max | 240 °C (30 seconds max) |
| Surface Mount | Yes |
| ECCN Code | 3A001.A.7.B |
| RoHS / REACH Compliance | Yes |
| HTS Code | 8542.39.00.01 |
| Weight | 0.02 kg |
Information About XCVU37P-2FSVH2892E
The XCVU37P-2FSVH2892E is part of Xilinx’s UltraScale+ series, offering a robust architecture with 162,960 configurable logic blocks (CLBs) and a total of 2,851,800 logic cells. Housed in a 2892-ball BGA package (55 mm × 55 mm, 1 mm pitch), the device supports a nominal core voltage of 0.85 V and operates up to 100 °C. It is surface-mountable and uses the HIPERFACE DSL® communication interface. The part conforms to RoHS and REACH compliance standards and features extended temperature grading and tin-silver-copper ball terminal finish. Designed for high-throughput, low-latency applications, this part supports 624 I/O channels and a peak reflow temperature of 240 °C.
Key Features:
- High Logic Density: Contains 2,851,800 logic cells organized into 162,960 CLBs.
- Large I/O Count: Supports 624 inputs and 624 outputs for high connectivity.
- Advanced Package: BGA2892 package (55×55 mm, 1 mm pitch) with max height of 4.51 mm.
- Low Core Voltage: Operates at 0.85 V nominal, supporting low power consumption.
- Extended Temp Range: Operates up to +100 °C for industrial-grade environments.
- RoHS & REACH Compliant: Meets environmental and safety standards.
- Moisture Sensitivity Level 4: Requires controlled storage and handling.
The XCVU37P-2FSVH2892E delivers the capacity, speed, and reliability required for advanced FPGA-based computing solutions.
Description
The XCVU37P-2FSVH2892E is a high-performance FPGA from the Xilinx Virtex UltraScale+ family, designed for compute-intensive and memory-focused applications. Featuring over 2.8 million logic cells and support for advanced memory interfaces, it is suitable for next-generation networking, signal processing, and data center acceleration.
Technical Specifications
| Condition | New/Never Used Surplus |
|---|---|
| Brand | Xilinx |
| Category |
Programmable Logic
|
| Part Number | XCVU37P-2FSVH2892E |
| Subcategory | Field Programmable Gate Arrays (FPGAs) |
| Product Type | Field Programmable Gate Array (FPGA) |
| Series | Virtex UltraScale+ |
| Logic Cells | 2,851,800 |
| CLBs | 162,960 |
| I/Os | 624 inputs, 624 outputs |
| Package Type | BGA2892 (S-PBGA-B2892, 55×55 mm) |
| Terminal Pitch | 1.0 mm |
| Seated Height Max | 4.51 mm |
| Voltage Range (Core) | 0.825 V – 0.876 V (0.85 V nominal) |
| Operating Temperature | Up to +100 °C |
| Moisture Sensitivity Level (MSL) | 4 |
| Terminal Finish | Tin-Silver-Copper (e1) |
| Reflow Temperature Max | 240 °C (30 seconds max) |
| Surface Mount | Yes |
| ECCN Code | 3A001.A.7.B |
| RoHS / REACH Compliance | Yes |
| HTS Code | 8542.39.00.01 |
| Weight | 0.02 kg |
Information About XCVU37P-2FSVH2892E
The XCVU37P-2FSVH2892E is part of Xilinx’s UltraScale+ series, offering a robust architecture with 162,960 configurable logic blocks (CLBs) and a total of 2,851,800 logic cells. Housed in a 2892-ball BGA package (55 mm × 55 mm, 1 mm pitch), the device supports a nominal core voltage of 0.85 V and operates up to 100 °C. It is surface-mountable and uses the HIPERFACE DSL® communication interface. The part conforms to RoHS and REACH compliance standards and features extended temperature grading and tin-silver-copper ball terminal finish. Designed for high-throughput, low-latency applications, this part supports 624 I/O channels and a peak reflow temperature of 240 °C.
Key Features:
- High Logic Density: Contains 2,851,800 logic cells organized into 162,960 CLBs.
- Large I/O Count: Supports 624 inputs and 624 outputs for high connectivity.
- Advanced Package: BGA2892 package (55×55 mm, 1 mm pitch) with max height of 4.51 mm.
- Low Core Voltage: Operates at 0.85 V nominal, supporting low power consumption.
- Extended Temp Range: Operates up to +100 °C for industrial-grade environments.
- RoHS & REACH Compliant: Meets environmental and safety standards.
- Moisture Sensitivity Level 4: Requires controlled storage and handling.
The XCVU37P-2FSVH2892E delivers the capacity, speed, and reliability required for advanced FPGA-based computing solutions.